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Vertiv CoolLoop Trim Cooler introduced

Integrating with high-density, liquid-cooled environments, the Vertiv CoolLoop Trim Cooler delivers operational efficiency and aligns with the industry’s evolving needs for energy-efficient and compact cooling solutions.

Vertiv, provider of critical digital infrastructure and continuity solutions, made another key addition to its industry-leading thermal management portfolio, with the introduction of the Vertiv CoolLoop Trim Cooler, in support of air and liquid cooling applications for AI (artificial intelligence) and HPC (high-performance computing). This global solution supports diverse climate conditions for hybrid-cooled or liquid-cooled data centres and AI factories.

Integrating with high-density, liquid-cooled environments, the Vertiv CoolLoop Trim Cooler delivers operational efficiency and aligns with the industry’s evolving needs for energy-efficient and compact cooling solutions. It provides up to a 70% reduction in annual cooling energy consumption leveraging free-cooling and mechanical operation, and 40% space savings compared to traditional systems. Designed to address the challenges of modern AI factories, the system supports fluctuating supply water temperatures up to 40°C and cold plate functionality at 45°C.

Straightforward water connections provide smooth and direct system integration for the Vertiv CoolLoop Trim Cooler and the Vertiv CoolChip CDU coolant distribution units, for direct-to-chip cooling. Vertiv CoolLoop Trim Cooler can also connect directly to immersion cooling systems. This simplifies installation and operational complexity, allowing compatibility across a range of high-density cooling environments, offering time savings and cost efficiencies for customers.

“Asia’s rapid digital transformation and AI-driven growth demand innovative cooling solutions that can handle high heat densities while improving energy efficiency. The Vertiv CoolLoop Trim Cooler is ideal for the region’s diverse climate conditions, providing scalable, high density cooling that reduces energy use and operational complexity. This future-friendly solution enables our customers to support AI and HPC infrastructure strategies while achieving significant space savings and simplifying installation,” said Cheehoe Ling, vice president, product management Asia at Vertiv.

The Vertiv CoolLoop Trim Cooler uses low-GWP refrigerant and offers a scalable cooling capacity up to almost 3 MW in the air-cooled configuration. With free cooling coils optimized for high ambient temperatures, the system is designed to operate in free cooling mode across more seasons and conditions, for reduced electrical consumption and CO2e emissions. It is compliant with 2027 EU F-GAS regulations ban, avoiding the need for costly redesigns or infrastructure upgrades to meet this upcoming regulatory requirement.

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