{"id":42364,"date":"2021-03-26T08:00:07","date_gmt":"2021-03-26T00:00:07","guid":{"rendered":"http:\/\/www.upgrademag.com\/web\/?p=42364"},"modified":"2021-03-26T08:00:12","modified_gmt":"2021-03-26T00:00:12","slug":"intel-ceo-pat-gelsinger-announces-idm-2-0-strategy-for-manufacturing-innovation-product-leadership","status":"publish","type":"post","link":"http:\/\/www.upgrademag.com\/web\/2021\/03\/26\/intel-ceo-pat-gelsinger-announces-idm-2-0-strategy-for-manufacturing-innovation-product-leadership\/","title":{"rendered":"Intel CEO Pat Gelsinger announces \u2018IDM 2.0\u2019 strategy for manufacturing, innovation, product leadership"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\"><strong>Intel CEO Pat Gelsinger outlined the company\u2019s path forward to manufacture, design and deliver leadership products and create long-term value for stakeholders. <\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">During the company\u2019s global \u201cIntel Unleashed: Engineering the Future\u201d webcast, Gelsinger shared his vision for \u201cIDM 2.0,\u201d\u00a0 a\u00a0 major\u00a0 evolution\u00a0 of\u00a0 Intel\u2019s\u00a0 integrated\u00a0 device\u00a0 manufacturing\u00a0 (IDM)\u00a0 model.\u00a0 Gelsinger\u00a0 announced significant manufacturing expansion plans, starting with an estimated $20 billion investment to build two new factories (or \u201cfabs\u201d) in Arizona. He also announced Intel\u2019s plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">\u201cWe are setting a course for a new era of innovation and product leadership at Intel,\u201d said Gelsinger. \u201cIntel is the only company with the depth and breadth of software, silicon and platforms, packaging, and process with at-scale manufacturing customers can depend on for their next-generation innovations. IDM 2.0 is an elegant strategy that only Intel can deliver \u2013 and it\u2019s a winning formula. We will use it to design the best products and manufacture them in the best way possible for every category we compete in.\u201d<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">IDM 2.0 represents the combination of three components that will enable the company to drive sustained technology and product leadership:<\/p>\n\n\n\n<ol class=\"wp-block-list\"><li><strong>Intel\u2019s global, internal factory network for at-scale manufacturing\u00a0<\/strong>is a key competitive advantage that enables product optimization, improved economics and supply resilience. Today, Gelsinger re- affirmed the company\u2019s expectation to continue manufacturing the majority of its products internally. The company\u2019s 7nm development is progressing well, driven by increased use of extreme ultraviolet lithography (EUV) in a rearchitected, simplified process flow. Intel expects to tape in the compute tile for its first 7nm client CPU (code-named \u201cMeteor Lake\u201d) in the second quarter of this year. In addition to process innovation, Intel\u2019s leadership in packaging technology is an important differentiator that enables\u00a0 the\u00a0 combination\u00a0 of\u00a0 multiple\u00a0 IPs\u00a0 or\u00a0 \u201ctiles\u201d\u00a0 to\u00a0 deliver\u00a0 uniquely\u00a0 tailored\u00a0 products\u00a0 that\u00a0 meet diverse customer requirements in a world of pervasive computing.<\/li><li><strong>Expanded use of third-party foundry capacity.\u00a0<\/strong>Intel expects to build on its existing relationships with third-party foundries, which today manufacture a range of Intel technology \u2013 from communications and connectivity to graphics and chipsets. Gelsinger said he expects Intel\u2019s engagement with third- party\u00a0 foundries\u00a0 to\u00a0 grow\u00a0 and\u00a0 to\u00a0 include\u00a0 manufacturing\u00a0 for\u00a0 a\u00a0 range\u00a0 of\u00a0 modular\u00a0 tiles\u00a0 on\u00a0 advanced process technologies, including products at the core of Intel\u2019s computing offerings for both client and data center segments beginning in 2023. This will provide the increased flexibility and scale needed to optimize Intel\u2019s roadmaps for cost, performance, schedule and supply, giving the company a unique competitive advantage.<\/li><li><strong>Building a world-class foundry business, Intel Foundry Services.\u00a0<\/strong>Intel announced plans to become a major provider of U.S.\u2013 and Europe-based foundry capacity to serve the incredible global demand for\u00a0 semiconductor\u00a0 manufacturing.\u00a0 To\u00a0 deliver\u00a0 this\u00a0 vision,\u00a0 Intel\u00a0 is\u00a0 establishing\u00a0 a\u00a0 new\u00a0 standalone business unit, Intel Foundry Services (IFS), led by semiconductor industry veteran\u00a0Dr. Randhir Thakur,\u00a0who will report directly to Gelsinger. IFS will be differentiated from other foundry offerings with a combination of leading-edge process technology and packaging, committed capacity in the U.S. and Europe, and a world-class IP portfolio for customers, including x86 cores as well as ARM and RISC-V ecosystem IPs. Gelsinger noted that Intel\u2019s foundry plans have already received strong enthusiasm and statements of support from across the industry.<\/li><\/ol>\n\n\n\n<p class=\"wp-block-paragraph\">To accelerate Intel\u2019s IDM 2.0 strategy, Gelsinger announced a significant expansion of Intel\u2019s manufacturing capacity, beginning with plans for two new fabs in Arizona, located at the company\u2019s Ocotillo campus. These fabs will support the increasing requirements of Intel\u2019s current products and customers, as well as provide committed capacity for foundry customers.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Intel plans to engage the technology ecosystem and industry partners to deliver on its IDM 2.0 vision. To that end, Intel and IBM today announced plans for an important research collaboration focused on creating next\u2013 generation logic and packaging technologies. For more than 50 years, the two companies have shared a deep commitment to scientific research, world-class engineering and a focus on bringing advanced semiconductor technologies to market. These foundational technologies will help unleash the potential of data and advanced computation to create immense economic value.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Leveraging&nbsp; each&nbsp; company\u2019s&nbsp; capabilities&nbsp; and&nbsp; talent&nbsp; in&nbsp; Hillsboro,&nbsp; Oregon,&nbsp; and&nbsp; Albany,&nbsp; New&nbsp; York,&nbsp; this collaboration aims to accelerate semiconductor manufacturing innovation across the ecosystem, enhance the competitiveness of the U.S. semiconductor industry and support key U.S. government initiatives.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Finally, Intel is bringing back the spirit of its popular Intel Developer Forum event this year with the launch of\u00a0Intel On, a\u00a0new industry event series. Gelsinger encouraged technology lovers to join him at this year\u2019s Intel Innovation event planned for October in San Francisco.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>IDM 2.0 represents the combination of three components that will enable the company to drive sustained technology and product leadership.<\/p>\n","protected":false},"author":6,"featured_media":42365,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[19],"tags":[385,96,2727,1656],"class_list":["post-42364","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-headlines","tag-intel","tag-technology","tag-technology-adaption","tag-technology-investment"],"_links":{"self":[{"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/posts\/42364","targetHints":{"allow":["GET"]}}],"collection":[{"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/comments?post=42364"}],"version-history":[{"count":0,"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/posts\/42364\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/media\/42365"}],"wp:attachment":[{"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/media?parent=42364"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/categories?post=42364"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.upgrademag.com\/web\/wp-json\/wp\/v2\/tags?post=42364"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}